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Figure 23 from High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed | Semantic Scholar
Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating – Influence of Electroless Pd Plating Film Thickness
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ball shear testing is also a destructive test which is used to assess... | Download Scientific Diagram
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